Intern - Engineering

This position is a 12-week paid internship located in Vandergrift Pennsylvania. It is offered for a period extending from mid-May through mid-August (exact dates depend on school calendars.) This position includes 401(k) options, an assigned mentor, capstone presentation, and intern events. If working onsite, you will have access to an onsite cafeteria option, and a one-time housing stipend. All internships provide hands-on experience with meaningful projects in the Medical Device Manufacturing Industry.

• Work with Engineers onsite at Cook Vandergrift plant to prototype solutions and/or improvements to existing manufacturing processes.
• Support Engineering team on daily activities and specific projects that directly impact the manufacturing plant operational performance.
• Hands-on industry experience in a medical device manufacturing plant.
• Develop Engineering skills to research, develop, and get buy-in on new solutions leading to process optimizations.
• Develop project management skills (project plan, risk identification and mitigation, hold people accountable, etc.).
• Develop understanding of medical devices regulations and its impact to final customers.
• Work with CVI employees as part of the Engineering team to lead and execute a project during the internship period with mentorship and guidance of an Engineer.
• Depending on the project assigned, work with members of the manufacturing team providing training to the new processes.
• Depending on the project assigned, create technical documentation and work instructions.
• Analyze data and provide suggestions to address negative trends and build-on positive ones.
• Create project plan and business analysis to design and prototype a clamshell packaging design to eliminate need for Belco sealer. Execute against plan during internship period.
• Develop pilot solution to introduce UV epoxy cure process.
• Develop solution for new solder stations. Research state of the art, develop timeline, business analysis, and execute against plan during internship period.

• Candidates should be students entering their Junior or Senior year the following fall semester or entering graduate school; candidates who graduate the spring semester before this internship are also eligible
• A minimum GPA of 3.0 is preferred
• All candidates must provide proof of enrollment (including pre-registration certification for the following fall) for consideration
• Engineering field student.
• Manufacturing process experience is a differential.
• Microsoft Office Package (word, excel, PowerPoint).
• Experience with AutoCAD 2D and 3D, or Solidworks.